Multilayer PCB Eing Blind and Buried Vias PCB Printed Circuit Board Motherboard HDI PCB Board with BGA Resin Plugging

FOB Price: US$5.00-15.00 / Piece
Min. Order: 1 Piece
Min. Order FOB Price
1 Piece US$5.00-15.00/ Piece
Port: Shenzhen, China
Production Capacity: 50000
Payment Terms: T/T, Western Union, Paypal
Multilayer PCB Eing Blind and Buried Vias PCB Printed Circuit Board Motherboard HDI PCB Board with BGA Resin Plugging

Product Description

Company Info

Address: B318, Taoyuan Commercial Building, Xixiang, Baoan District, Shenzhen, Guangdong, Ganzhou, Jiangxi, China
Business Type: Manufacturer/Factory
Business Range: Computer Products, Consumer Electronics, Electrical & Electronics, Industrial Equipment & Components, Light Industry & Daily Use, Lights & Lighting
Management System Certification: ISO 9001, ISO 14001, IATF16949
Company Introduction: Multech Electronic Limited specializes in manufacturing Printed Circuit Boards from 2 to 24 layer. We offer quick-turn, high technology printed circuit boards in prototype and moderate production volumes. All of which are manufactured at our modern production plant in China.

In an increasingly competitive nowadays, Base material unceasingly rises, the pressure of competition continuously appear to every enterprise, so reduce the purchase cost became to the most important action in all enterprise. Well, In gazillion PCB factory in Chinamainland, MULTECH is one of PCB Manufacturer that you search for high quality and low cost.

We go on where other companies want to stop.

We can always provide you with the latest technologies because of our close cooperation with Universities and R& D departments.

We always are in close contact with material suppliers and want to test their latest material that they want to bring on to the market.

In this modern world where change is a daily common thing it′s good to have a partner like "MULTECH".

We are more than happy to make your thoughts reality and make your first design to a real live Printed Circuit Board.

We are ISO9001 certificated, IATF16949 and UL approved. Follow up IPC-600F Class 2 standard.

Our Capability:

No. Of Layers Available 1- 24

Base material: FR4, CEM1, CEM3, ALU, FR2, FR1, Polymide, Rogers, Arlon, Teflon)

Flux Coat, Flash Gold, HASL, Immersion Gold & OSP

Min. Line Width: 0.08mm

Min. Line Spacing: 0.08mm

Min. Annual Ring PTH: 0.15mm

Non-PTH: 0.20mm

Min Hole Size PTH: 0.1mm

Non-PTH: 0.15mm

Hole Aspect Ratio: 10

Min. Board Thickness Single & Double Sided 0.2mm

Multilayer (4, 6, 8, 10) 0.4mm, 0.55mm, 0.8mm, 0.8mm

Max Board Size: 600mm X 900mm, 400*1200mm

Solder Mask Pitch: 0.1mm

Hole Tolerance: PTH +/-0.05mm

Non-PTH: +/-0.05mm

Hole Position Tolerance: +/-0.05mm

Outline Tolerance Routing: 0.15mm

Punching: +/-0.15mm

Thickness Tolerance: MIL-P-13949 Class 2

V-Cut Tolerance Depth: +/- 0.10mm

Position: +/-0.10mm

Gold Finger: 5 u" - 50 u"

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